ISQED'26 Embedded Tutorials
Chair & Moderators:
Na Gong - University of Alabama(Chair)
Tutorial 1
Wednesday, April 8, 12:25PM-1:25PM
Advanced Packaging: Current State and Looking Forward
Presenter:
Dr. William Lambert, AMD
William LambertAbstract: Advanced packaging is now an essential component of high-performance SOC design, spanning applications from low-cost consumer CPUs to leading-edge AI processors. For AI applications in particular, advanced packaging is indispensable – it is the only way to enable the integration of large compute area, high memory capacity, and massive memory bandwidth required for competitive products. This tutorial will provide an overview of advanced packaging strategies currently in use, including hybrid bond stacking, silicon interposer, and fan-out bridge technologies, with a focus on their implementation in AMD products. Next, future directions for scaling these technologies will be reviewed with an emphasis on how new concepts in SOC architecture and circuit design may drive “Design Technology Co-Optimization” (DTCO) in years to come. Finally, the tutorial will review how adjacent areas are developing to support the disaggregated designs enabled by advanced packaging, including package and silicon design and verification tools, electrical and mechanical simulation tools, sort, and test.
About
William Lambert
William Lambert is a Fellow of AMD, Inc. where he leads a team creating the packaging solutions for next-generation AI products. He previously worked on packaging solutions for datacenter and client GPUs and CPUs. Prior to joining AMD, he was a Senior Principal Engineer in the Assembly & Test Technology Development group at Intel Corporation, where he held leadership roles in packaging architecture definition, power delivery and integrated voltage regulation technology development, and RF packaging development. He received his Ph.D. in electrical engineering from Arizona State University with a focus on low-voltage DC-DC power electronics for computer systems, and his M.S. and B.S. degrees from Rochester Institute of Technology.
Tutorial 2
Thuesday, April 9, 1:05PM-2:05PM
When Quantum Computing Meets Quantum Sensing: End-to-End Design Principles and Applications
Presenter:
Prof. Jianqing Liu , NC State University
Jianqing LiuAbstract: Harnessing quantum resources such as entanglement can enable sensing beyond the classical limits of precision, with the realization of such sensors poised for transformative impacts across science and engineering. In existing quantum sensing systems, classical measurement data are recorded and then processed by classical post-processing techniques like Bayesian algorithms to extract relevant information. Due to the shot noise accumulation in the post-processing algorithms, there is a fundamental limitation on the capability of the “quantum sensing + classical processing” paradigm. In this talk, I will present a new research direction that combines quantum computing with quantum sensing. The basic idea is to apply quantum algorithms to process the quantum information prior to measurements, thus avoiding the use to tomography methods and accumulation of shot noises due to classical processing algorithms. I will discuss the end-to-end design principles, associated challenges, and opportunities for the effective combination of quantum computing and quantum sensing. I will also give some use cases for this new paradigm.
About Jianqing Liu
Prof. Jianqing Liu is an associate professor with the Department of Computer Science at the NC State University, USA. Prior to joining NC State, he was an assistant professor with University of Alabama in Huntsville from 2018-2022. Dr. Liu received his PhD degree in computer engineering from the University of Florida in 2018. His current research interests include quantum networking, quantum sensing, network security, and data privacy. Dr. Liu is the recipient of NSF CAREER award in 2022 and several best paper awards including the 2018 IEEE TCGCC best journal paper award. He currently serves in the editorial board of IEEE Transactions on Wireless Communications, IEEE Transactions on Communications and Journal of Selected Areas in Communications (Quantum Series).