ISQED 2016 Technical Program Committee
Peter Wright, Synopsys (General Chair)
Saibal Mukhopadhyay, Georgia Institute of Technology (TPC Co-Chair)
Brian Cline, ARM (TPC Co-Chair)
Cognitive Computing in Hardware (CCH)
Yiran Chen, University of Pittsburgh (Chair)
Vikas Chandra, ARM (Co-Chair)
Committee Members:
Yu Cao - Arizona State University
Abishai Daniel - Intel
Miao Hu - HP labs
Hao Jiang - San Francisco State University
Yang Yi - University of Kansas
Hardware and System Security (HSS)
Miodrag Potkonjak, UCLA (Chair)
Bao Liu, University of Texas at San Antonio (Co-Chair)
Committee Members:
Jia Di - University of Arkansas
Domenic Forte - University of Florida
Ken Mai - Carnegie Mellon University
Seetharam Narasimhan - Intel Corp
Nicolas Sklavos - Computer Engineering & Informatics Department, University of Patras
xuehui zhang - Oracle
Design Technology Co-Optimization (DTCO)
Fedor Pikus (Chair)
Rajan Beera, Pall Corporation (Co-Chair)
Committee Members:
Kevin Brelsford - Synopsys
Tuhin Guha Neogi - GLOBALFOUNDRIES
Vivek Joshi - GLOBALFOUNDRIES
Murari Mani - AMD
Jimson Mathew - University of Bristol
Mustafa Berke Yelten - Istanbul Technical University
Vladimir Zolotov - IBM
Design Verification and Design Testability (DVFT)
Sreejit Chakravarty, Intel Corporation (Chair)
Vinod Viswanath (Co-Chair)
Committee Members:
George Alexiou - Univ. Of PATRAS
Alberto Bosio - LIRMM - UM
Serge Demidenko - Massey University
Ping Gao - Aries Design Automation
Abhilash Goyal - IEEE Member
Michael Hsiao - Virginia Tech
Jon Nafziger - Texas Instruments
Suriya Natarajan - Intel Corporation
Dimitris Nikolos - nikolosd
Kiran Puttaswamy - Samsung
Spyros Tragoudas - Southern Illinois University Carbondale
Miroslav N. Velev - Aries Design Automation
Arnaud Virazel - LIRMM
HUNG-PIN WEN - National Chiao Tung University
Cai Yu - SK Hynix
Wenwei Zha - Qualcomm Inc
EDA, Physical Design, and IP Cores (EDA)
Anand Iyer (Chair)
Vamsi Srikantam (Co-Chair)
Committee Members:
Yici Cai - Tsinghua Univ.
Zhuo Feng - Michigan Technological University
Eric Foreman - IBM
Dhruva Ghai - ORIENTAL UNIVERSITY INDORE
Shih-Hsu Huang - Chung Yuan Christian University
Srinivas Katkoori - University of South Florida
Srini Krishnamoorthy - Advanced Micro Devices Inc.
Yu-min Lee - National Chiao Tung University
Rung-Bin Lin - Yuan Ze University
Ofelya Manukyan - CAD/EDA maintenance
Rajeev Murgai - Synopsys India Pvt. Ltd.
Andre Reis - UFRGS
Emre Salman - Stony Brook University
Takashi Sato - Kyoto University
Jia Wang - Illinois Institute of Technology
Hua Xiang - IBM Research
Guo Yu - Oracle
Min Zhao - oracle
Emerging Process&Device Tech. &Design Issues (EDT)
Paul Tong (Chair)
Swaroop Ghosh, University of South Florida (Co-Chair)
Committee Members:
Shih-Hung Chen - Imec
Qiang Cui - Qorvo Inc.
Jayita Das - Sr. Technology and Design Integration Engineer
Nikos Konofaos - AUTh
Chun-Yu Lin - National Taiwan Normal University
Guofu Niu - guofu.niu
Renato ribas - UFRGS
Swatilekha Saha - Cypress Semiconductor Corporation
Aida Todri-Sanial - CNRS-LIRMM
Rasit Onur Topaloglu - IBM
Huaqiang Wu - Tsinghua University
Integrated Circuit Design (ICD)
Charles Augustine, Intel Circuit Research Lab (Chair)
Steve Heinrich-Barna, Texas Instruments, Inc (Co-Chair)
Committee Members:
Ali Afzali-Kusha - University of Tehran
Plamen Asenov - Gold Standard Simulations
Karan Bhatia - Texas Instruments, Inc.
Srinivas Bodapati - Intel
Paulo Butzen - Universidade Federal do Rio Grande - FURG
subho chatterjee - intel corporation
Minki Cho - Intel Corp.
Mike DiRenzo - Texas Instruments
Guanming Huang - Synopsys
Ajay Joshi - Boston University
Rouwaida Kanj - American University of Beirut
Jin-Fu Li - National Central University
Aswin Mehta - Texas Instruments Inc
Riaz Naseer - Intel Corporation
Arijit Raychowdhury - Georgia Institute of Technology
Kurt Schwartz - Texas Instruments
Jeremy Tolbert - Samsung Austin R&D Center
Haibo Wang - Texas A&M International University
Cheng Zhuo - Intel Corp.
Smart Sensors for IoT –Design &Technology (SSDT)
Xiaoning Qi (Chair)
Vijay Raghunathan, Purdue University (Co-Chair)
Committee Members:
Vittorio Ferrari - University of Brescia
Kamesh Gadepally - GigaCom Semiconductor
Michel Maharbiz - U.C. Berkeley
Libor Rufer - University of Grenoble
Thilo Sauter - Danube University Krems
System-level Design and Methodologies (SDM)
Rajesh Berigei (Chair)
Shiyan Hu, Michigan Technological University (Co-Chair)
Committee Members:
Ik Joon Chang - Kyunghee University
Kai Cong - Intel Corporation
Rosilde Corvino - Intel
Abhijit Davare - Intel
Fabiano Hessel - PUCRS
Selcuk Kose - University of South Florida
Hana Kubatova - CTU in Prague
Hai (Helen) Li - University of Pittsburgh
Duo Liu - Chongqing University
Vivek Nandakumar - Synopsys
Gabriela Nicolescu - Ecole Polytechnique de Montréal
Antonio Nunez - University of Las Palmas GC
Sudeep Pasricha - Colorado State University
Shana-Jang Ruan - National Taiwan University of Sci. and Tech.
Tuna Tarim - Texas Instrument, Inc.
Tianyi Wang - Florida International University
Yu Wang - Auburn University, ECE department
Bei Yu - The Chinese University of Hong Kong
3 Dimensional Integration &Adv. Packaging (TDIP)
Sung Kyu Lim, Georgia Tech (Chair)
Kambiz Samadi, Qualcomm Technologies, Inc. (Co-Chair)
Committee Members:
Ismail Bustany - Mentor Graphics
Nauman Khan - Intel Coporation
Dae Hyun Kim - Washington State University
Manuel Luschas - Broadcom
Shreepad Panth - Altera Corporation
Yiyu Shi - University of Notre Dame
Saurabh Sinha - ARM Inc.
Jianyong Xie - Intel
HL Yiu - Hong Kong Science and Technology Parks
Hirokazu Yonezawa - Panasonic Corporation
Payman Zarkesh-Ha - University of New Mexico
Ehrenfried Zschech - Fraunhofer IKTS