International Society for Quality Electronic Design (ISQED) would like to invite you to contribute a chapter in this authoritative book, slated for publication in 2024 by Springer. This comprehensive guide explores the application of AI in electronic design, covering all aspects from concept generation to manufacturing and testing. Your chapter could focus on a specific area, such as hardware security, 3D integration, or memory technology. Join us in sharing your insights and expertise to advance this rapidly evolving field. Contact us to learn more about contributing to this valuable resource.
This book intends to be a comprehensive guide to leveraging artificial intelligence in electronic circuit and system design. The book covers all aspects of the design process, including semiconductor device design, ASIC design, 3D integration, hardware security, and more. It also explores the potential of hardware accelerators for AI and cognitive-inspired computing, memory technology, and system security. This book is an essential resource for professionals and researchers seeking to improve efficiency, accuracy, and reduce costs in electronic design through AI techniques and technologies.
IMPORTANT DATES (US Pacific Time) |
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Chapter Proposal | July 30, 2023 |
Acceptance/Rejection and Feedback to Authors | Aug. 31, 2023 |
Full Chapter Submission | Dec. 15, 2023 |
Editor Review Feedback to Authors | Jan. 29, 2024 |
Camera ready Submission | April 15, 2024 |
Final Print | Sept. 15, 2024 |
The book “AI-Enabled Electronic Circuit and System Design - From Ideation to Utilization” aims to explore the application of artificial intelligence (AI) in the design process of electronic circuits and systems, covering the complete design process, from concept generation to manufacturing and testing, and highlights how AI can improve the efficiency and accuracy of the design process while reducing costs and time-to-market.
The book delves into various aspects of electronic design, such as semiconductor device design and manufacturing, including AI-assisted lithography, device modeling, and transistor level circuit design. It also covers innovative design techniques for ASIC design, analog design, place and route, timing analysis, clock tree synthesis, and hardware security. The book also includes an exploration of 3D integration, hardware-software co-development, RFIC design, FPGA design, and PCB level design.
Additionally, the book covers topics such as adaptive and resilient digital circuits and systems, cognitive-inspired computing systems, and safe and secure machine learning. It also explores the potential of hardware accelerators for artificial intelligence and cognitive-inspired computing with big data. The book addresses memory technology, including SRAM technology, DRAM technology, flash technology, and emerging memory technologies, as well as hardware and system security.
The book also addresses design test and verification, including advanced test methodologies, testbenches, and flows, test synthesis and synthesis for testability, hardware/software co-verification, and formal and semi-formal verification and validation techniques. It also covers self-checking testbenches in analog verification and electronic design automation.
In summary, this book provides a comprehensive overview of the application of AI in electronic circuit and system design, covering all aspects from ideation to utilization. It will be a valuable resource for professionals and researchers interested in this rapidly evolving field.
Book is envsioned to be divided into Parts, each part to consist of of several chapters. Chapter contributions are sought for but not limited to the following topics:
This section provides an overview of the book's objectives and outlines the scope and structure of the book.
This section covers the application of AI in semiconductor device design and manufacturing. Some key concepts are AI-assisted lithography, device modeling, and transistor level circuit design.
This section covers the application of AI in ASIC design. Area of interest are use of AI in concept generation, design capture, physical design, manufacturing, packaging, and testing.
This section covers the application of AI in analog as well as RFIC design,covering topics in AI in concept generation, design capture, physical design, manufacturing, packaging, and testing.
This section covers the application of AI in place and route. Key concepts in this chapter are use of AI in concept generation, design capture, physical design, manufacturing, packaging, and testing.
This section covers the application of AI in timing analysis.
This section covers the application of AI in clock tree synthesis.
This section covers the application of AI in hardware security.
This section covers the application of AI in 3D integration, covering topics in AI in concept generation, design capture, physical design, manufacturing, packaging, and testing.
This section covers the application of AI in hardware-software co-development.
This section covers the application of AI in all aspects of FPGA design.
This section covers the application of AI in all topics related to PCB level design,such as, physical design, manufacturing, packaging, and testing.
This section covers the application of AI in all apects of adaptive and resilient digital circuits and systems.
This section covers the application of AI in cognitive-inspired computing systems.
This section covers the application of AI in safe and secure machine learning.
This section covers the application of hardware accelerators for artificial intelligence.
This section covers the application of AI in cognitive-inspired computing with big data, including the use of AI in concept generation, etc.
A chapter proposal need to be submitted prior to deadline shown above. Proposal should be limited to between 1000-2000 words, or about 2 to 4 pages using the IEEE format provided later below. Ideally there should be a one-to-one correspondence between the proposal and one of the book chapters listed in this call. The proposal should describe how the chapter fits into the general theme of the book, include a description of the goal and scope of the chapter, detail list of topics to be covered, and how much space will be allocated to each topic. Only electronic submissions in PDF format will be considered. Use A4 IEEE template in MS Word from this LINK and convert to PDF. Email your proposalto isqedisqed@gmail.com.
Your proposal must be made on or before the due date specified. Submissions will be reviewed by committee and notifications regarding the status of the chapter proposal will be made available to authors by date shown. Based on accepted chapter proposals, chapter submissions will be accepted on above date. All submitted chapters will be reviewed by 3 or more reviewers. Each chapter must be prepared in accordance with the submission guidelines and should preferably be between 30 to 50 pages long, including graphs, references, and appendices. Only electronic submissions in PDF format will be considered. Final submission must be made through the link provided above. Your submission must be made on or before the submission deadline and cannot be under review for any other conference, journal, or book during the entire time it is considered for this book. For more information, please contact isqedisqed@gmail.com.