Network on Interconnect Fabric

Boris Vaisband, Adeel Bajwa, Subramanian Iyer
University of California, Los Angeles


Silicon interconnect fabric (Si-IF) supports integration of bare dies using thermal compression bonding on a Si wafer substrate. Fine pitch (2 to 10 μm) horizontal and vertical interconnects are feasible within the Si-IF using standard Si processing techniques. A network on interconnect fabric (NoIF) is proposed in this paper. The NoIF enables integration of ultra large scale heterogeneous systems within the technologically mature Si-IF platform. NoIF is based on utility dies which serve as intelligent nodes within the network. NoIF enables global communication, power conversion and management, synchronization, processing and memory capabilities, redundancy allocation, and test of the Si-IF, and the utility and functional dies.