ISQED05
Tuesday March 22, 2005
Session 1D
City Foyer
10:30am – 3:15pm
Poster Session Chairs: James Lei,
Altera Israel Koren, University of Massachusetts Amherst 1D.1
Non-Charge-Sheet
Core and Architecture of BSIM5 Jin
He, Jane Xi, Mansun Chan, Hui Wan, Mohan Dunga, Babak Heydari,, Ali M.
Niknejad, Chenming Hu, University of California, Berkeley 1D.2
Integration
of DFM Practices in Design Flows L.Riviere
Cazaux, Freescale Semiconductors 1D.3
How
Circuit Analysis and Yield Optimization Can Be Used to Detect Circuit
Limitations before Silicon Results Carlo
Roma, Pierluigi Daglio, Guido De Sandre, Marco Pasotti, Marco Poles,
STMicroelectronics 1D.4
Leakage
Current Modeling in Pd SOI Circuits Mini
Nanua*, David Blaauw**, MI, Chanhee Oh***, *Sun Microsystems, Austin,
TX, **University of Michigan, ***Nascentric, Austin, TX 1D.5
A
Balanced Scorecard for Systemic Quality in Electronic Design Automation:
An Implementation Method for an EDA Company Jasjeet
Kaur, Mentor Graphics 1D.6
RCL
Characterization and Modeling of X Architecture Diagonal Wires for VLSI
Design Narain
D. Arora, Li Song, Santosh Shah, Kalyan Thumaty, Aki Fujimura, Victor
Chang*, S. Y. Cho*, Cadence Design Systems, *TSMC 1D.7
A
Technique for Designing Totally Self-Checking Domino Logic Circuits C.K.
Tang, P.K. Lala, J.P. Parkerson, University of Arkansas 1D.8
Early
Assessment of Leakage Power For System Level Design C.
Talarico, B.S. Pillilli, K.L.Vakata. J.M. Wang, University of Arizona 1D.9
Technology
Mapping For Reliability Enhancement in Logic Synthesis Zhaojun
Wo, Israel Koren, University of Massachusetts Amherst 1D.10
Evaluation
of Capacitor Ratios in Automated Accurate Common-Centroid Capacitor
Arrays Diaaeldin
Khalil*, Mohamed Dessouky*, Vincent Bourguet**, Marie-Minerve Louërat**,
Andreia Cathelin***, *Hani Ragai Ain
Shams University, Egypt, **University of Paris 6, France,
***STMicroelectronics, France 1D.11
Closing
the Gap Between Carry Select Adder and Ripple Carry Adder: A New Class
of Low-Power High-Performance Adders Behnam
Amelifard*, Farzan Fallah**, Massoud Pedram*, *University of Southern
California, **Fujitsu Laboratories of America, Inc. 1D.12
Capacitance
and Yield Evaluations Using a 90-Nm Process Technology Based on the
Dense Power-Ground Interconnect Architecture Atsushi
Kurokawa, Masaharu Yamamoto, Nobuto Ono, Tetsuro Kage, Yasuaki Inoue,
Hiroo Masuda, Semiconductor Technology Academic Research Center, Japan 1D.13
Testing
for Resistive Shorts in FPGA Interconnects Haixia
Gao, Yintang Yang, Xiaohua Ma, Gang Dong, Xidian University, P.R. China 1D.14
TED
Thermo-Electrical Designer: A New Physical Design Verification Tool Sokolowska
Ewa, Barszcz Marek, Kaminska Bozena, Pultronics Inc. 1D.15
A
Fast Lithography Verification Framework for Litho-Friendly Layout Design Yong-Chan
Ban, Soo-Han Choi, Ki-Hung Lee, Dong-Hyun Kim, Ji-Suk Hong, Yoo-Hyon
Kim, Moon-Hyun Yoo, Jeong-Taek Kong, Samsung,
South Korea 1D.16
Gate-Level
Mitigation Techniques for Neutron-Induced Soft Error Rate Harmander
S. Deogun, Dennis Sylvester, David Blaauw, University of Michigan 1D.17
Exact
Algorithms for Coupling Capacitance Minimization by Adding One Metal
Layer Hua
Xiang, Kai-Yuan Chao, Martin D.F. Wong, IBM 1D.18
Design
of a 10-bit TSMC 0.25um CMOS Digital to Analog Converter J.
Huynh, B. Ngo, M. Pham, Lili He, San Jose State University 1D.19
A
High-Performance SRAM Technology with Reduced Chip-Level Routing
Congestion for SOC R.
Castagnetti, R. Venkatraman, B. Bartz, C. Monzel, T. Briscoe, A. Teene,
S. Ramesh, LSI Logic 1D.20
Design
and Evaluation of a Security Scheme for Sensor Networks Khadija
Stewart, Themistoklis Haniotakis, Spyros Tragoudas, Southern Illinois
University Carbondale 1D.21
A
Minimum Cut Based Re-Synthesis Approach M.
Welling, S.Tragoudas, H. Wang, Southern Illinois University Carbondale 1D.22
Analysis
for Complex Power Distribution Networks Considering Densely Populated
Vias Young-Seok
Hong, Heeseok Lee, Joon-Ho Choi, Moon-Hyun Yoo, Jeong-Taek Kong, Samsung
Korea 1D.23
Buffer
Planning Algorithm Based on Partial Clustered Floorplanning Yuchun
Ma, Xianlong Hong, Sheqin Dong, Song Chen, Chung-Kuan Cheng, Tsinghua
University, China 1D.24
Issues
and Challenges in Ramp to Production Ravi
Arora, Arun Shrimali, Anand Venkitachalam, Texas Instruments
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