Session 3A

3:30pm - 5:30pm

Modeling and simulations of Electromigration and Eletromagnetic Effect

Co-Chairs

Tom Chen, Col State - Ft. Collins
James Lei, Altera

3:30pm

Introduction

3:35pm

3A-1    Physically-Based Simulation of Electromigration Induced Failures in Copper Dual-Damascene Interconnect
Valeriy Sukharev 

4:05pm

3A-2    Circuit Level Reliability Analysis of Cu Interconnects
Syed M. Alam, Gan Chee Lip, Carl V. Thompson, and Donald E. Troxel     

4:35pm

3A-3            A Methodology for Chip-Level Electromigration Risk Assessment and Product Qualification
Chanhee Oh, Haldun Haznedar, Vladimir Zolotov, Martin Gall, Amir Grinshpon, Pon Ku, Rajendran Panda

4:50pm