Session 3B
3:30pm - 5:30pm
Impact of New Standards for Design Data Modeling and Manufacturing Interface
Co-Chairs
Andrew Kahng, University of California, San Diego
Tom Chen, Colorado State University
3:30pm
Introduction
3:35pm
3B-1 Assessment of the Open Access Standard: Insights on the New EDA Industry Standard From Hewlett Packard, an Early Beta Partner and Contributing Development (Invited), Terry Blanchard, Hewlett Packard
4:05pm
3B-2 Impact of Interoperability on CAD-IP Reuse (Invited), Igor Markov, University of Michigan
4:35pm
3B-3 Interoperability Beyond Design: Sharing Knowledge Between Design and Manufacturing (Invited), Don Cottrell, Si2
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