Session 5B
Wednesday 3/22/00
3:25pm - 5:35pm
Design for Manufacturability
Glendy Sun, TSMC, Vinod Malhotra, Numerical TechnologiesCo-Chairs:
3:25pm
Introduction
3:30pm
5B.1
Design And Variability, Or Why We Need To Get Closer To The Edge (Invited)Sani R. Nassif, IBM Austin Research Laboratory, Austin, TX
3:55pm
5B.2
Realistic Worst-Case Modeling by Performance Level Principal Component AnalysisAlessandra Nardi*, Andrea Neviani*, Carlo Guardiani**, *DEI, Universita‘ di Padova, Padova, Italy, **PDF Solutions, Inc. San Jose, CA
4:20pm
5B.3
Efficient Full-Chip Yield Analysis Methodology for OPC-Corrected VLSI DesignsV. Axelrad*, N. Cobb**, M. O’Brien**, V. Boksha***, T. Do**, T. Donnelly**, Y. Granik**, E.Sahouria**, A. Balasinski****, *SEQUOIA Design Systems, Woodside, CA, **Mentor Graphics, San Jose, CA, ***MIT Sloan School of Management, Cambridge, MA, ****Cypress Semiconductor, San Jose, CA
4:45pm
5B.4
Electronic Process Limited YieldGary W. Maier*, Shawn Smith**, *IBM, ** Knights
5:10pm
5B.5
Effects of Package Stackups on Microprocessor PerformanceMehdi Mechaik, Cisco Systems, San Jose, CA
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